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Molybdenum Copper
Coefficient of thermal expansion (CTE) of molybdenum copper composties can be tailored by adjusting the composition, which is the same way with tungsten copper composites. MoCu is much lighter than tungsten cooper, which make it more suitable for aerospace usage.
Properties for molybdenum copper composites
| Composition | Mo wt% | Cu wt% | Density g/cm3 |
Thermal conductivity W/(M.K) |
CTE (10-6/K) |
| Mo85Cu15 | 85 ± 2 | Balance | 10 | 160 - 180 | 6.8 |
| Mo80Cu20 | 80 ± 2 | Balance | 9.9 | 170 - 190 | 7.7 |
| Mo70Cu30 | 70 ± 2 | Balance | 9.8 | 180 - 200 | 9.1 |
| Mo60Cu40 | 60 ± 2 | Balance | 9.66 | 210 - 250 | 10.3 |
| Mo50Cu50 | 50 ± 2 | Balance | 9.54 | 230 - 270 | 11.5 |
Available Molybdenum copper products: Sheet, Foil, Bar, Rod, Block, Plate, and other customized parts.
The most important usage of copper molybdenum is heat sinks for electronic devices. We can also provide Mo/Cu/Mo, Mo/CuMo/Mo parts. Visit our Heat sinks page for more information.
Besides MoCu and (Tungsten copper) WCu heat sinks, we can also provide pure molybdenum, Cu-Mo-Cu Heat Sinks, Molybdenum-Copper-Molybdenum products, Cu-MoCu-Cu parts.
Cu-Mo-Cu (CMC materials) Heat Sinks Specification:
| Cu: Mo: Cu (Thick ratio) | Density (g/cc) | Coefficient of Thermal Expansion (10-6/K) | Thermal Conductivity (W/m·K), x-y direction | Thermal Conductivity (W/m·K), x-z direction |
|---|---|---|---|---|
| 1:1:1 | 9.4 | 9.4 | 300~310 | 240~250 |
| 1:2:1 | 9.6 | 7.7 | 260~270 | 210~220 |
| 1:3:1 | 9.7 | 6.9 | 230~240 | 190~200 |
| 1:4:1 | 9.8 | 6.2 | 210~220 | 170~180 |
| 13:74:13 | 9.9 | 5.8 | 190~200 | 160~170 |
Cu-Mo70Cu-Cu (CPC material) Heat Sinks Specification:
|
Cu-Mo70Cu-Cu (Thick ratio) |
Density (g/cc) | Coefficient of Thermal Expansion (10-6/K) | Thermal Conductivity (W/m·K) | ||
| Plate direction | Thick direction | Plate direction | Thick direction | ||
| 1:4:1 | 9.46 | 7.2 | 9.0 | 250-300 | 210-250 |
Picture for MoCu products
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Molybdenum Copper Block -
Molybdenum Copper Foil