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Semiconductor devices such as power transistors and optoelectronics such as lasers and light emitting diodes (LEDs), where the heat dissipation ability of the basic device is insufficient to moderate its temperature.
A heat sink is designed to maximize its surface area in contact with the cooling medium surrounding it, such as the air. Air velocity, choice of material, protrusion design and surface treatment are factors that affect the performance of a heat sink.
MoCu and WCu materials (molybdenum copper & tungsten copper composites) are widely used in heat sinks because of their good Thermal Conductivity and Coefficient of Thermal Expansion, the price is lower than GaN and SiN heat sinks.
- Tungsten copper heat sink
- Heat sinks
Properties for heat sinks by copper molybdenum and copper tungsten.
|Composites of heat sink||W88Cu||W85Cu||W80Cu||Mo90Cu||Mo88Cu||Mo85Cu||Mo20Cu|
|Coefficient of Thermal Expansion (10-6/K)||5.57||5.7||6.76||5.60||5.75||5.95||6.98|
|Thermal Conductivity (W/m·K)||188||196||220||160||170||187||215|
|Heat sink size||2”,4” diameter x Thickness, with gold and other coatings|
Besides MoCu and WCu heat sinks, we can also provide pure molybdenum, Cu-Mo-Cu, Cu-MoCu-Cu parts
Cu-Mo-Cu Heat Sinks Specification:
|Cu: Mo: Cu (Thick ratio)||Density (g/cc)||Coefficient of Thermal Expansion (10-6/K)||Thermal Conductivity (W/m·K), x-y direction||Thermal Conductivity (W/m·K), x-z direction|
Cu-Mo70Cu-Cu Heat Sinks Specification:
|Density (g/cc)||Coefficient of Thermal Expansion (10-6/K)||Thermal Conductivity (W/m·K)|
|Plate direction||Thick direction||Plate direction||Thick direction|
ETI provides complete service for copper tungsten, copper molybdenum, pure molybdenum, Cu-Mo-Cu and Cu-Mo70Cu-Cu heat sinks. Send your request to firstname.lastname@example.org.
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