Non-ferrous Metals

Deposition Materials

Rare Earth Elements

Semiconductor Elements

Functional Materials

CeO2 Polishing powder

The larger particle size of cerium oxide: the larger the particle size of cerium oxide, the larger grinding force it needs. This ismore more suitable for harder materials. Fine polishing powder should be used for ZF glass. The particle size we are talking about here is the D50 size.The pilishing speeds on the D50, while the polishing presision depoends on DMax.



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